The big list of electronic component and integrated circuit (IC) package types


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// March 14th, 2017 // Electronics

Integrated circuit packages, the form an IC is manufactured in, are as wide and varied as a Donald Trump “alternative truth”.  Below is the big list of integrated circuit (IC) package types including the package name, package full (official) name, remarks and notes, and a picture of diagram of the electronic package.

Through-hole packages

Through-hole IC packages have leads which can be soldered onto a PCB or inserted into a breadboard slot.

SIP or SIL Single in-line package Has one row of connecting pins often with a lead frame used as a heat sink. SIP or SIL - single in-line package
DIP (DIL or DIPP) Dual in-line package Has two parallel rows of connecting pins – 0.1 in (2.5 mm) pin spacing, rows 0.3 in (7.6 mm) or 0.6 in (15 mm) apart. Sometimes referred to as Dipn where n=total number of pins. DIP - Dual in-line package
CDIP Ceramic DIP   CDIP - Ceramic DIP package
CERDIP Glass sealed ceramic   CERDIP - Glass sealed ceramic package
QIP or QIL Quadruple in-line package Looks like a DIP but with staggered (zig-zag) pins to allow more reliable soldering. QIP - Quadruple in-line package
SDIP Skinny DIP Standard DIP with 0.1 inch pin spacing, rows 0.3 inches apart. SDIP - skinny DIP package
ZIP Zig-zag in-line package A short-lived packaging technology initially intended to replace the dual in-line packaging. Typically has 20 or 40 pins with rows staggered 1.27mm apart. Used by Acorn and Commodore Amiga. ZIP - Zig-zag in-line package
MDIP Molded DIP   MDIP - molded DIP package
PDIP Plastic DIP   PDIP - Plastic DIP package

 

Surface mount packages

CCGA Ceramic Column Grid Array   CCGA - Ceramic Column Grid Array package
CGA Column Grid Array    
CERPACK Ceramic package A hermetically sealed ceramic package with leads extending from both of its longer sides. CERPACK - Ceramic package
CQGP      
LLP Leadless leadframe package   LLP - Leadless leadframe package
LGA Land Grid Array Has pins on the socket (when a socket is used) rather than the IC. Contacts are connected to a grid of contacts on the PCB.  Not all rows and columns of the grid are used. Used in microprocessors such as Intel Pentium 4, Xeon, Core 2, and AMD Opteron. LGA - Land Grid Array package
LTCC Low temperature co-fired ceramic Entire Ceramic support structure and any conductive, resistive, and dielectric materials are fired in a kiln at the same time. Typical devices include capacitors, inductors, resistors, transformers, and hybrid circuits. Often used in military electronics or RF applications. LTCC - Low temperature co-fired ceramic package
MCM Multi-Chip Module Come in a variety of forms and classified according to the technology used to create the HDI substrate. MCM - Multi-chip module package
MICRO SMDXT Micro Surface Mount Device extended technology    

Chip carrier

A chip carrier has contacts on all four edges are are typically soldered onto a PCB circuit board or inserted into a socket.

BCC Bump Chip Carrier   BCC - Bump Chip Carrier package
CLCC Ceramic Leadless Chip Carrier   CLCC - Ceramic leadless chip carrier package
LCC Leadless Chip Carrier   LCC - Leadless Chip Carrier package
LCC Leaded Ceramic Chip Carrier   LCC - Leaded Ceramic Chip Carrier package (Texas Instruments)
LCCC Leaded Ceramic Chip Carrier    
DLCC Dual Leadless Chip Carrier (Ceramic)    
PLCC Plastic Leaded Chip Carrier   PLCC - Plastic Leaded Chip Carrier package

Pin grid arrays

A pin grid array (PGA) is a package with pins arranged as an array on the underside of the package.  Pins are commonly spaced 2.54mm apart and may or may not cover the entire underside of the package.  PGAs are commonly mounted on printed circuit boards using the through-hole method or inserted into a socket.

OPGA Organic Pin Grid Array   OPGA - Organic Pin Grid Array package
FCPGA or FC-PGA Flip-chip pin Grid Array   FC-PGA - Flip-chip Pin Grid Array package
PAC Pin Array Cartridge    
PGA or PPGA Pin grid array   PGA (or PPGA) - Pin grid array package
CPGA Ceramic Pin Grid Array   CPGA - Ceramic Pin Grid Array package

Flat packages (aka Flatpack)

Flatpack is a US military standardized printed circuit board surface mount package.

CFP Ceramic Flat Pack   CFP - Ceramic Flat Pack package
CQFP Ceramic Quad Flat-Pack   CQFP - Ceramic Quad Flat-Pack package
BQFP Bumpered Quad Flat Pack Type of QFP with bumpers on four corners to protect leads against mechanical damage BQFP - Bumpered Quad Flat Pack package
DFN Dual Flat Pack   DFN - Dual Flat Pack package
ETQFP Exposed Thin Quad Flat Package    
PQFN Power Quad Flat-Pack   PQFN - Power Quad Flat Pack package
PQFP Plastic Quad Flat Package    
LQFP Low-profile Quad Flat Package   LQFP - Low-profile Quad-Flat package
QFN Quad Flat No-leads package Also called MLF. Offers advantages including reduce lead inductance, small footprint, and low weight. QFN - Quad Flat No-leads package
QFP Quad Flat Package A surface mount IC package with gull wing leads extending from each of its four sides. Similar to a PLCC package but with pins of less pitch. Typically 2.0 to 3.8 mm thick. QFP - Quad Flat Package
MQFP Metric Quad Flat Pack QFP with metric pin distribution  
HVQFN Heat-sink Very-thin Quad Flat-pack No-leads A type of QFP with no component leads extending from the IC. Pads are spaced along the sides of the IC with an exposed DIE that can be used as ground.  
SIDEBRAZE Sidebraze package Ceramic package with leads extending from both of the longer sides (a type of dual in-line package). It is hermetically sealed with a metal cap. SIDEBRAZE - Sidebraze package
TQFP Thin Quad Flat Pack Similar to QFP but thinner. Typically has pins with 0.8mm pitch in a package 5mm by 5mm by 1mm thick. TQFP - Thin Quad Flat Package
TQFN Thin Quad Flat No-Lead   TQFN - Thin Quad Flat No-Lead package
VQFP Very-thin Quad Flat Pack    
ODFN Optical Dual Flat No-Lead Packaged in a transparent package for use in optical sensors ODFN - Optical Dual Flat No-Lead package

Small outline packages

SOP Small Outline Package   SOP - Small Outline Package
CSOP Ceramic Small Outline Package   CSOP - Ceramic Small Outline Package
HSOP Thermally Enhanced Small-Outline Package   HSOP - Thermally Enhanced Small-Outline Package
MSOP Mini Small-Outline Package   MSOP - Mini Small-Outline Package
PSOP Plastic Small-Outline Package   PSOP - Plastic Small Outline Package
PSON Plastic Small-Outline No-Lead Package    
QSOP Quarter-Size Small-Outline Package    
SOIC Small Outline Integrated Circuit Also known as SOIC NARROW and SOIC WIDE.  Typically named SOIC-n where n= number of pins. SOIC - Small Outline Integrated Circuit package
SOJ J-leaded SOIC package A version of SOIC with J-type leads instead of gull-wing leads. SOJ - J-leaded SOIC package
SSOP Shrink Small-Outline Package Have gull wing leads protruding from two long sides with lead spacing of 0.65mm. Often used in pagers, portable audio/video, disc drives, radio, and telecom products. SSOP - Shrink Small Outline Package
TSOP Thin Small-Outline Package   TSOP - Thin Small-Outline package
TSSOP Thin Shrink Small Outline Package Has legs protruding from the wide portion of the package with a leg count of 8 to 64. TSSOP - Thin Shrink Small Outline Package
TVSOP Thin Very Small-Outline Package   TVSOP - Thin Very Small-Outline Package
uMAX   Maxim trademarked package similar to a SOIC uMAX - Maxim package
WSON Very Very Thin Small Outline No Lead Package   WSON - Very Very Thin Small Outline No Lead Package

Chip-Scale packages

ICs with an area no greater than 1.2 times that of the die (per J-STD-012 standard).

CSP Chip Scale Package Package is no more than 1.2x the size of the silicon chip CSP - Chip-Scale Package
TCSP or TDSP True Chip Size Package Package is same size as silicon TCSP - True Chip Size Package
MICRO SMD   CSP developed by National Semiconductor  
COB Chip-on-board A bare silicon chip without a package COB - Chip-on-board package
COF Chip-on-flex Variation of COB – chip mounted on flex circuit COF - Chip-on-flex package
COG Chip-on-glass Variation of COB – chip mounted on piece of glass (i.e. LCD) COG - Chip-on-glass package

Ball grid array

Surface-mount package typically used to permanently mount devices such as microprocessors. Soldering of these devices must be precise and is typically done by automated processes.

FBGA Fine Pitch Ball Grid Array   FBGA - Fine Pitch Ball Grid Array package
LBGA Low Profile Ball Grid Array Also known as Laminate Ball Grid Array  
TEPBGA Thermally Enhanced Plastic Ball Grid Array    
CBGA Ceramic Ball Grid Array   CBGA - Ceramic Ball Grid Array package
OBGA Organic Ball Grid Array    
TFBGA Thin Fine Pitch Ball Grid Array    
CTBGA Chip-Array Thin Core Ball Grid Array   CTBGA - Chip Array Thin Core Ball Grid Array package
PBGA Plastic Ball Grid Array   PBGA - Plastic Ball Grid Array
MAP-BGA Mold Array Process – Ball Grid Array    
UCSP Micro Chip Scale Package   UCSP - Micro Chip Scale Package
uBGA Micro-Ball Grid Array Ball spacing is less than 1mm  
LFBGA Low Profile Fine Pitch Ball Grid Array    
TBGA Thin Ball Grid Array   TBGA - Thin Ball Grid Array package
VTBGA Very Thin Ball Grid Array   VTBGA - Very Thin Ball Grid Array package
SBGA Super Ball Grid Array Has more than 500 pins  
UFBGA Ultra Fine Ball Grid Array    

Transistor, diode, and small pin packages

MELF Metal Electrode Leadless Face Type of leadless surface mount package that is metalized on both ends. MELF - Metal Electrode Leadless Face package
SOD Small Outline Diode Surface mount diode package. SOD package
SOT Small-outline transistor Small footprint, surface mount typically used for transistors but also diodes and voltage regulators. SOT package
TO-3 Panel mount with leads Often used for transistors, rectifiers, and ICs.  Usually has two mounting holes, two leads, the case being the third connection. TO-3 package
TO-5 Metal can package with radial leads Often used for transistors and some integrated circuits. Base diameter of 8.9mm, cap diameter of 8.1mm, and cap height of 6.3mm. TO-5 package
TO-18 Metal can package with radial leads Metal cased, simliar to TO-92 package (but more expensive).  The tab is located 45 degree from pin 1 (typically the emitter). Lead diameter of .45 mm, cap diameter of 4.5 – 4.95mm, and overall width of 5.4mm. TO-18 package
TO-39     TO-39 package
TO-46     TO-46 package
TO-66 Similar to TO-3 but smaller. Similar to the TO-3 package but smaller. TO-66 package
TO-92 Plastic encapsulated package with three leads Widely used for transistors. Typically cased with epoxy or plastic. TO-92 package (transistor)
TO-99     TO-99 package
TO-100     TO-100 package
TO-126   Plastic encapsulated package with three leads and a hole for mounting on a heat sink TO-126 package
TO-220   Through-hole plastic package typically with a metal heat sink tab and three leads TO-220 package
TO-226   A small plastic-molded transistor outline package commonly used for discrete devices such as transistors, thyristors, and ICs with low lead counts. TO-226 package
TO-247   Plastic encapsulated package with three leads and hole for mounting on a heat sink TO-247 package
TO-251 or IPAK   Similar to DPAK but with longer leads TO-251 package
TO-252 (SOT428 or DPAK)   Similar to DPAK but smaller TO-252 package
TO-262 (I2PAK)   Similar to D2PAK but with longer leads TO-262 package
TO-263 (D2PAK)   Similar to TO-220 without the extended tab and mounting hole TO-263 (D2PAK or DDPAK) package
TO-274 (Super-247)   Similar to TO-247 but without the mounting hole TO-274 package

Additional information

IC chip dimensions

Surface-mount

How to read surface mount IC chip dimensions

C – Clearance between IC body and PCB
H – Total Height
T – Lead Thickness
L – Total Carrier Length
LW – Lead Width
LL – Lead Length
P – Pitch

Through hole

How to read surface mount IC chip dimensions

C – Clearance between IC body and board
H Total Height
T – Lead Thickness
L – Total Carrier Length
LW – Lead Width
LL – Lead Length
P – Pitch
WB – IC Body Width
WL – Lead-to-Lead Width-

All measurements below are given in mm. To convert mm to mils, divide mm by 0.0254 (i.e., 2.54 mm / 0.0254 = 100 mil).

C – Clearance between package body and PCB.
H – Height of package from pin tip to top of package.
T – Thickness of pin.
L – Length of package body only.
LW – Pin width.
LL – Pin length from package to pin tip.
P – Pin pitch (distance between conductors to the PCB).
WB – Width of the package body only.
WL – Length from pin tip to pin tip on the opposite side.





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